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型號(hào)
像元尺寸
像元數(shù)
像元中心距
響應(yīng)度-峰值
暗電流
帶寬
封裝類型
封裝
引腳數(shù)
窗口
ULMPIN-14-TT-N0112U ?55 μm 12 × 1 250 μm 0.6A/W 0.02 nA@-2V 12 GHz Chip Chip - -
ULMPIN-14-TT-N0104U ?55 μm 4 × 1 250 μm 0.6A/W 0.02 nA@-2V 12 GHz Chip Chip - -
ULMPIN-25-TT-N0112U ?42 μm 12 × 1 - 0.6A/W 0.2 nA@-2V 20 GHz Chip Chip - -
ULMPIN-25-TT-N0104U ?42 μm 4 × 1 - 0.6A/W 0.2 nA@-2V 20 GHz Chip Chip - -
ULMPIN-56-TT-N01012U ?39 μm 12 × 1 250 μm 0.6A/W <0.1 nA@-2V 20 GHz Chip Chip - -
ULMPIN-56-TT-N0104U ?39 μm 4 × 1 250 μm 0.6A/W <0.1 nA@-2V 20 GHz Chip Chip - -
FCI-GaAs-12M ?70 μm 12 × 1 250 μm 0.63A/W@850nm 0.03 nA@-5V 2.0 GHz Chip Ceramic Submount - -
ULMPIN-04-TN-U0112U ?100 μm 12 × 1 250 μm 0.5A/W 10 nA@-20V 4 GHz Chip Chip - -
ULMPIN-04-TN-U0104U ?100 μm 4 × 1 250 μm 0.5A/W 10 nA@-20V 4 GHz Chip Chip - -
ULMPIN-10-TT-N0112U ?70 μm 12 × 1 250 μm 0.6A/W 0.02 nA@-5V 8 GHz Chip Chip - -
ULMPIN-10-TT-N0104U ?70 μm 4 × 1 250 μm 0.6A/W 0.02 nA@-5V 8 GHz Chip Chip - -
FCI-GaAs-4M ?70 μm 4 × 1 250 μm 0.63A/W@850nm 0.03 nA@-5V 2.0 GHz Chip Ceramic Submount - -
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